Silicon-based micromachined packages for high-frequency applications

A novel low-cost packaging approach is presented in this paper, which is ap propriate for high-frequency electronic circuits in discrete, as well as in tegrated, configurations. This approach is based on silicon micromachining and can effectively provide on-wafer and discrete packaging for high-qualit y high-precision miniature components. The required fabrication techniques are compatible with standard integrated-circuit processing and, for this re ason, are low in fabrication costs. As an example, this paper presents the development of a K a-band package that can shield and electromagnetically i solate monolithic-microwave integrated-circuit components, such as a phase shifter, The performance of this package is compared to that of a ceramic o ne and demonstrates excellent electrical response in addition to high desig n versatility.