An iterative cutting procedure for determining the optimal wafer exposure pattern

Authors
Chien, CF Hsu, SC Chen, CP
Citation
Cf. Chien et al., An iterative cutting procedure for determining the optimal wafer exposure pattern, IEEE SEMIC, 12(3), 1999, pp. 375-377
Citations number
4
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
ISSN journal
08946507 → ACNP
Volume
12
Issue
3
Year of publication
1999
Pages
375 - 377
Database
ISI
SICI code
0894-6507(199908)12:3<375:AICPFD>2.0.ZU;2-U
Abstract
Conventionally, people focus on defect reduction to improve yield rate. Lit tle research has been done to deal with the problem of optimizing wafer exp osure patterns. This paper develops a computer-based procedure to maximize the number of dies possibly produced from a wafer. A program has been devel oped and implemented in a 6-in wafer fabrication factory in Taiwan. The res ults validate the practical viability of the proposed procedure.