Tape casting of high dielectric ceramic substrates for microelectronics packaging

The production of ceramic green tapes is integral to the production of mult ilayer ceramic packages and capacitors. This article presents a batch type process for producing alumina ceramic green tape down to 150 mu m thickness . The process parameters relevant to the precise control of the thickness o f an alumina-based ceramic tape have been investigated using a float glass tape easter. Results indicate that the cast tape thickness was dependent on the blade gap until it reached a limiting value. This limiting thickness i n turn was dependent on the casting speed, with a higher speed producing th inner tapes. Optimal casting was shown to exist when the blade gap was set at or beyond the limiting value, with the casting speed the controlling fac tor for the final thickness.