Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

Authors
Liu, HJ Feng, JC Qian, YY Li, ZR
Citation
Hj. Liu et al., Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint, J MAT SCI L, 18(13), 1999, pp. 1011-1012
Citations number
5
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
02618028 → ACNP
Volume
18
Issue
13
Year of publication
1999
Pages
1011 - 1012
Database
ISI
SICI code
0261-8028(19990701)18:13<1011:ISAFMO>2.0.ZU;2-D