The effect of grain size on electric properties has been investigated. Vari
ous (111) oriented PLZT films were prepared using the RF magnetron sputteri
ng method on Pt/Ti/SiO2/Si substrates. Grain size and surface roughness wer
e observed by AFM. The results showed that; 1) surface roughness depends on
average grain size and 2) decreasing grain size decreases process degradat
ion and fatigue. The grain boundary was thought to be responsible for proce
ss damage, such as reduction by hydrogen, at electrode interface tops. Elec
tric field strength at grain boundaries also increased with increases in su
rface roughness.