N. Sekino et al., The mechanisms behind the improved dimensional stability of particleboardsmade from steam-pretreated particles, HOLZFORSCH, 53(4), 1999, pp. 435-440
The mechanisms which cause an improvement in the dimensional stability of p
articleboards made from steam pretreated particles were investigated from t
he aspects of potential thickness recoveries of densified wood particles an
d the breakage of the adhesive bond network in particleboards. Since the la
tter would depend on the balance between bond strengths and stresses impose
d on the adhesive bond, the effects of steaming temperature (160 to 220 deg
rees C) on bond quality, recovery stress of compressed wood and in-plane sw
elling stress were investigated. Steam pretreatment was found: 1) to reduce
thickness recoveries of densified wood particles, steaming temperatures ab
ove 190 degrees C are especially effective, 2) not to cause a significant r
eduction in bond strength when steaming below 210 degrees C or if relativel
y high press pressures of 1.5 MPa are employed, 3) to reduce recovery stres
s of compressed wood, which is mainly caused by the increase in wood compre
ssibility, 4) to reduce in-plane swelling stress of particles, which was fo
und to correlate with reductions in both hygroscopicity and elasticity.