1.6 wt% Mg-containing Al-1.0 wt% Si films exposed to air during the lifetim
e test have been investigated for electromigration resistance. The films wi
th Al2O3 or MgO dielectrics near the metal surface are more effective for i
ncreasing electromigration resistance and, thus, also extend the lifetime a
nd enhance the activation energy up to 0.79 eV.