Effect of postoxidation annealing on Si/SiO2 interface roughness

Citation
Xd. Chen et Jm. Gibson, Effect of postoxidation annealing on Si/SiO2 interface roughness, J ELCHEM SO, 146(8), 1999, pp. 3032-3038
Citations number
32
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
146
Issue
8
Year of publication
1999
Pages
3032 - 3038
Database
ISI
SICI code
0013-4651(199908)146:8<3032:EOPAOS>2.0.ZU;2-I
Abstract
We use a plan-view transmission electron microscope technique to unambiguou sly image the "physical" interface position between Si and furnace grown Si O2 layers. The effect of postoxidation annealing on the interface roughness of Si/SiO2 was studied with this technique. While no obvious effect due to postoxidation annealing on roughness was observed for silicon (111) a post oxidation annealing at 900 degrees C dramatically removed roughness at Si(1 00)/SiO2 interfaces. A model was developed to explain our experimental resu lts based on the idea of kinetic smoothening and oxidation induced rougheni ng. Qualitative agreement has been reached. (C) 1999 The Electrochemical So ciety. S0013-4651(98)05-046-0. All rights reserved.