Thin strained Si layers grown on SiGe layers graded to 20% Ge were studied
for resistance to relaxation. It was observed that in the presence of simil
ar to 10(5)/cm(2) threading dislocations from the underlying graded layers,
the barrier to misfit dislocation formation is sufficiently reduced to ind
uce relaxation in Si layers even when the layer thickness is less than the
predicted critical thickness. Raman spectroscopy revealed that elastic stra
in accumulation in the uniform SiGe layers is a significant contributor to
strain relaxation in the Si cap layers. Upon annealing, thermal mismatch ca
uses the Si layers to relax further, but most of the strain relaxation is a
ccommodated by elastic strain increase in the SiGe layers. This prevents th
e rampant increase in defect density that would otherwise accompany the str
ain relaxation. Annealing in an oxidizing ambient appears to pin pre-existi
ng threading dislocations causing nucleation of new threading dislocations
and short misfit segments to relieve the thermal mismatch stresses. (C) 199
9 American Vacuum Society. [S0734-211X(99)04204-3].