Low-energy electron-beam lithography using calixarene

Citation
A. Tilke et al., Low-energy electron-beam lithography using calixarene, J VAC SCI B, 17(4), 1999, pp. 1594-1597
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
17
Issue
4
Year of publication
1999
Pages
1594 - 1597
Database
ISI
SICI code
1071-1023(199907/08)17:4<1594:LELUC>2.0.ZU;2-Q
Abstract
Low-energy electron-beam lithography using calixarene as a negative electro n resist has been investigated in the energy range between 0.5 and 20 keV. The suitability of electron energies down to 2 keV with a writing resolutio n of about 10 nm is clearly demonstrated. At low electron energies the requ ired electron dose is drastically reduced. Moreover, irradiation damage dur ing the exposure of a high-mobility two-dimensional electron gas using cali xarene plays no significant role in the low-energy regime. (C) 1999 America n Vacuum Society. [S0734-211X(99)60804-5].