Low-energy electron-beam lithography using calixarene as a negative electro
n resist has been investigated in the energy range between 0.5 and 20 keV.
The suitability of electron energies down to 2 keV with a writing resolutio
n of about 10 nm is clearly demonstrated. At low electron energies the requ
ired electron dose is drastically reduced. Moreover, irradiation damage dur
ing the exposure of a high-mobility two-dimensional electron gas using cali
xarene plays no significant role in the low-energy regime. (C) 1999 America
n Vacuum Society. [S0734-211X(99)60804-5].