Ef. Venger et al., Formation and thermal stability of contacts based on titanium borides and titanium nitrides with gallium arsenide, SEMICONDUCT, 33(8), 1999, pp. 865-869
The formation mechanisms and thermal stability of contacts, fabricated by i
on-plasma sputtering of titanium borides and nitrides on gallium arsenide,
are investigated by structural, secondary-emission, photoluminescence, and
electrical methods. A physical model, according to which the solid solution
s BxGa1-xAs and GaNxAs1-x are formed in the process of deposition on the ph
ase boundary, is proposed on the basis of the data obtained. It is shown th
at the correlation between the physicochemical interactions at the phase bo
undaries of the contacts and their electrical parameters is due to defects
that arise in the contact layers of the semiconductor during the formation
of the heterostructures and subsequent treatments. It is established that t
he high thermal stability of the experimental objects is due to their bilay
er structure, which sharply decreases interdiffusion processes at the phase
boundary. (C) 1999 American Institute of Physics. [S1063-7826(99)01308-3].