Si resonant interband tunnel diodes that demonstrate negative differential
resistance at room temperature, with peak-to-valley current ratios greater
than 2, are presented. The structures were grown using low-temperature (320
degrees C) molecular-beam epitaxy followed by a postgrowth anneal. After a
650 degrees C, 1 min rapid thermal anneal, the average peak-to-valley curr
ent ratio was 2.05 for a set of seven adjacent diodes. The atomic distribut
ion profiles of the as-grown and annealed structures were obtained by secon
dary ion mass spectrometry. Based on these measurements, the band structure
was modeled and current-voltage trends were predicted. These diodes are co
mpatible with transistor integration. (C) 1999 American Institute of Physic
s. [S0003-6951(99)01935-X].