Enhanced flip-chip packaging technique boosts IC reliability and performance

Authors
Bursky, D
Citation
D. Bursky, Enhanced flip-chip packaging technique boosts IC reliability and performance, ELECTR DES, 47(17), 1999, pp. 29-30
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONIC DESIGN
ISSN journal
00134872 → ACNP
Volume
47
Issue
17
Year of publication
1999
Pages
29 - 30
Database
ISI
SICI code
0013-4872(19990823)47:17<29:EFPTBI>2.0.ZU;2-Q