Aj. Sierakowski et Lf. Eastman, Analysis of Schottky gate electron tunneling in polarization induced AlGaN/GaN high electron mobility transistors, J APPL PHYS, 86(6), 1999, pp. 3398-3401
(gate = nickel)/(barrier = GaN/Al(y)Ga(1 - y)N)/(buffer = GaN)/(substrate =
SiC) polarizationinduced high electron mobility transistors (PI-HEMTs) sho
w promise for ultrahigh power microwave amplification. The polarization fie
lds in these Ga-face, wurtzite structures are used to engineer the conducti
on band profile in the absence of any doping. One important attribute of th
ese PI-HEMTs is their ability to withstand electric fields up to 3 MV/cm wi
thout avalanche breakdown. The combination of high electric field under the
gate necessary to pinch off the channel, and the high electric field fring
ing to the gate from the large drain-source bias voltage, makes it possible
for electron tunneling from the gate into and through the GaN/Al(y)Ga(1 -
y)N barrier into the GaN channel. A one-dimensional theoretical analysis of
the tunneling current at pinchoff as a function of the aluminum fraction (
0.05 < y < 0.45) in the barrier, the operating temperature of the gate meta
l at 300 and 573 K, and a uniform additional electric field of -1 and -2 MV
/cm from drain bias reveals the potential for these GaN based devices to im
pose negligible current loading by the gate on a microwave driver. Unlike G
aAs, avalanche breakdown induced by gate leakage is unimportant in these Ga
N based power devices. (C) 1999 American Institute of Physics. [S0021-8979(
99)05617-0].