S. Kato et Hx. Hu, MD analyses of surface reaction and adsorbed free particle behavior in LP-CVD silicon wafer processing, JSME I J B, 42(2), 1999, pp. 249-254
Citations number
14
Categorie Soggetti
Mechanical Engineering
Journal title
JSME INTERNATIONAL JOURNAL SERIES B-FLUIDS AND THERMAL ENGINEERING
By using the molecular dynamics method (MD) and computer graphics (CG), the
surface processing mechanism of SiH2-->Si+2H in LP-CVD silicon wafer fabri
cation is analyzed, in which we introduce a chemical reaction model consist
ing of the activating energy and attack angle between SiH2 gaseous molecule
s and Si atom monocrystalline. The atom surface adsorption and inelastic co
llision are discussed considering energy exchange between the particles and
surface. Moreover, the potential state and behavior of hydrogen atom adsor
bed as a free particle are also calculated and discussed. The relevant pote
ntial surface of H free particle in the Si crystal lattice is found to be u
seful to understand its potential state and behavior.