First results about a new system suited for epitaxial growth on six 2' SiC-
wafers at a time are presented in comparison to typical results in a single
wafer CVD system. As expected, the multi wafer system today shows a by one
order of magnitude higher background impurity level (less than or equal to
10(15) cm(-3) compared to less than or equal to 10(14) cm(-3)). On the oth
er hand, the doping homogeneity is already very encouraging. The total vari
ation on a 2 inch wafer is less than +/- 20% at about 1*10(16) cm(-3). The
surface of the epitaxial layers is very smooth with a typical growth step h
eight of 0.5 nm (4H 8 degrees off orientation). First measurements on Schot
tky diodes show low leakage current values indicating low point defect dens
ity in the epitaxial layers. (C) 1999 Elsevier Science S.A. All rights rese
rved.