Defects in commercially available silicon carbide (SiC) wafers have been in
vestigated by X-ray topography and optical microscopy. Dots appearing in tr
ansmission topographs are identified as a screw dislocation running through
the [0001] direction by a comparative observation of the reflection topogr
aphs from the front and rear sides. In the peripheral region, these dots ap
pear with high density and accompany large strain fields at the edge, which
are related with the dislocations in the basal plane emanating from the do
ts and connecting them and large holes with diameters of about 10-20 mu m o
pening at the epilayer surface. These large strain fields are considered to
originate from the large Burgers vector associating with the screw disloca
tions. (C) 1999 Elsevier Science S.A. All rights reserved.