The aim of this study was to improve the adhesion of Au Schottky contacts t
o SiC. In order to do this, before the deposition of the Au layer, a thin l
ayer of Ti was deposited. However, this resulted in an anomalous step in th
e forward bias electrical characteristic for some diodes. An equivalent cir
cuit model is introduced to explain this irregularity in terms of two barri
er heights. PSPICE is used to simulate this model. Simulated and experiment
al data are in good agreement over the temperature range 25 to 250 degrees
C. (C) 1999 Elsevier Science S.A. All rights reserved.