P-N Junction creation in 6H-SiC by aluminum implantation

Citation
L. Ottaviani et al., P-N Junction creation in 6H-SiC by aluminum implantation, MAT SCI E B, 61-2, 1999, pp. 424-428
Citations number
4
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
ISSN journal
09215107 → ACNP
Volume
61-2
Year of publication
1999
Pages
424 - 428
Database
ISI
SICI code
0921-5107(19990730)61-2:<424:PJCI6B>2.0.ZU;2-0
Abstract
Bipolar diodes, protected with junction termination extensions, were proces sed in 6H-SiC. A 5-fold aluminum implantation was carried out for the main p(+)-n junction creation, which led to the material amorphization. The recr ystallization variation with the annealing temperature and duration is exam ined in this paper. We performed the Al implantations with apposite energy orders, in order to study their influence on the diode electrical character istics. The increasing order led to a better forward conduction. and revers e leakage currents more important. (C) 1999 Elsevier Science S.A. All right s reserved.