A major issue in the heteroepitaxial growth of cubic silicon carbide (3C-Si
C) is the stress generated by the lattice and thermal mismatch of the subst
rate. The growth of beta SiC on ceramic (polycrystalline) SIC is reported h
ere. This substrate is thermally matched to single crystal SIC and allows t
he SIC to be grown at a temperature of 1500-1600 degrees C. Therefore, this
substrate offers a significantly wider parameter space for optimization of
cubic growth. In order to provide a crystalline template for growth, a nov
el wafer bonding scheme was used to produce ultra thin Si layers, which wer
e wafer bonded to the ceramic substrate. Using this technology, single crys
tal Si layers less than 5 nm can be produced. It should be noted that the c
eramic substrates are inexpensive and this technique is easily scaleable up
to 8 in, in diameter. Using this material, the thin Si layer was carbonize
d and 3C-SiC grown at temperatures of 1350 and 1550 degrees C. (C) 1999 Els
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