The model predicts the solidification path in the aluminum corner of the Al
CuFeMgMnSi phase diagram, with compensation for solid-state diffusion and p
article growth undercoolings. Input is the composition and the rate of cool
ing. Output is the temperature vs fraction solid; the solid-state concentra
tion profiles; the type, volume fraction, and size of the intermetallic par
ticles; and also the temperature-dependent thermal conductivity, density, s
pecific heat, and heat of fusion for use in thermal models.