Packaging and thermal evaluation of thermally operated intelligent micropump unit

Authors
Morrissey, A Alderman, J Kelly, G Kohari, Z Pahi, A Rencz, M
Citation
A. Morrissey et al., Packaging and thermal evaluation of thermally operated intelligent micropump unit, MICROELEC J, 30(11), 1999, pp. 1109-1114
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS JOURNAL
ISSN journal
00262692 → ACNP
Volume
30
Issue
11
Year of publication
1999
Pages
1109 - 1114
Database
ISI
SICI code
0026-2692(199911)30:11<1109:PATEOT>2.0.ZU;2-4
Abstract
After presenting the challenges and solutions of the 3D packaging of a medi cal implant MEMS device the paper presents thermal simulations on the struc ture. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper. (C) 1999 Elsevi er Science Ltd. All rights reserved.