Instability of an elastically compressed silicon surface under etching

Citation
Yg. Shreter et al., Instability of an elastically compressed silicon surface under etching, PHYS SOL ST, 41(8), 1999, pp. 1295-1297
Citations number
16
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICS OF THE SOLID STATE
ISSN journal
10637834 → ACNP
Volume
41
Issue
8
Year of publication
1999
Pages
1295 - 1297
Database
ISI
SICI code
1063-7834(199908)41:8<1295:IOAECS>2.0.ZU;2-1
Abstract
An unusual relief in the form of linear defects resembling quasicracks or g rooves was observed on a compressionally stressed surface of a bent silicon surface subjected to chemical etching. The average distance between the fo rming defects was determined by the magnitude of the surface mechanical str ain. The reason for this is assumed to be an Asaro-Tiller-Srolovitz instabi lity in the compressed-surface-etching-agent system. A simple technique is proposed for producing considerable mechanical strains, up to 0.5%, in a si licon surface at room temperature. (C) 1999 American Institute of Physics. [S1063-7834(99)01308-8].