B. Lagel et al., A novel detection system for defects and chemical contamination in semiconductors based upon the Scanning Kelvin Probe, SURF SCI, 435, 1999, pp. 622-626
A novel wafer scale detection system for defects and chemical contamination
in semiconductors based upon the Scanning Kelvin Probe (SKP) is presented.
It incorporates traditional work function (phi) topography with high resol
ution (<0.1 meV). surface photovoltage (SPV) measurement and surface photov
oltage-deep level transient spectroscopy (SPV-DLTS). This permits quasi-sim
ultaneous determination of surface charge, surface potential and carrier li
fetime, as well as the characterisation of deep level defects.
The SKP system is introduced and the SPV and SPV-DLTS measurement modes are
discussed. Surface charge measurements on clean and Fe-contaminated p-type
Si(100) wafers show that iron induces negative charge in both native and t
hermally grown oxide layers. SPV-DLTS is demonstrated on defects in thermal
ly oxidised Si.
The system is both non-contact and non-destructive. requires no wafer prepa
ration, and can be applied in both ambient and vacuum environments. (C) 199
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