Heat transfer to a single particle injected into a thermal plasma

Citation
R. Ramasamy et V. Selvarajan, Heat transfer to a single particle injected into a thermal plasma, COMP MAT SC, 15(3), 1999, pp. 265-274
Citations number
18
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
COMPUTATIONAL MATERIALS SCIENCE
ISSN journal
09270256 → ACNP
Volume
15
Issue
3
Year of publication
1999
Pages
265 - 274
Database
ISI
SICI code
0927-0256(199908)15:3<265:HTTASP>2.0.ZU;2-9
Abstract
This paper is concerned with the study of the heat transfer between a therm al plasma and a particle injected into it, with emphasis on the effects whi ch the evaporation of the latter imposes on heat transfer from the former. The investigation was done by numerical methods. The results refer mainly t o an atmospheric pressure argon plasma. As a comparison nitrogen plasma was considered in a temperature range from 3000 to 25,000 K. Interaction of pl asma with alumina and tungten particles were considered. Evaporation severe ly reduced heat transfer to a particle and, in general, this effect was mor e pronounced for materials with low latent heat of evaporation. The conduct ive heat transfer from plasma (Ar, N-2, Ar + H-2) to a particle of radius 5 0 mu m was calculated and compared with the radiative heat loss from the pa rticle. The results of a relatively simple analysis showed that except for a particle with a surface temperature above 2100 K immersed in an argon or a nitrogen plasma below 4100 K, radiation heat losses from the particle to the surroundings are negligible compared to the conductive heat flux from p lasma to the particle. The minimum value of plasma temperature for a partic le to attain boiling point was calculated. The calculated results for the l owest value of plasma temperature for the three materials (Alumina, Tungste n, Graphite) and four plasmas (Ar, N-2, H-2, Ar + H-2) are reported. The pl asma temperature is higher for higher boiling paint materials and lower for higher enthalpy plasmas. (C) 1999 Elsevier Science B.V. All rights reserve d.