A simple fabrication method for a self-aligned offset structure, which uses
photoresist reflow, is developed to reduce the leakage current of polysili
con thin-film transistors (poly-Si TFT's), The reflow of photoresist can be
controlled by varying photoresist thickness and reflow temperature. It is
found that the reflow length increases in proportion to the photoresist thi
ckness, and increases with increasing reflow temperature at less than 200 d
egrees C for the AZ5214A photoresist, Poly-Si TFT's are successfully demons
trated with offset lengths of 0.4 and 0.6 mu m, which show apparent reducti
on of the leakage current.