Electrical characterization of integrated circuit molding compound

Broadband dielectric characterization techniques were applied to a novolac epoxy molding compound used in the integrated circuit industry. Both dielec tric loss tangent and relative dielectric constant were determined over the frequency range from 100 MHz to 1.4 GHz, using two independent measurement methods. The molding compound was in "as-molded condition," which resemble s the use conditions for the material.