High reliability, high density, low cost packaging systems for matrix systems for matrix BGA and CSP by vacuum printing encapsulation systems (VPES)

Ball grid array (BGA) and chip scale package (CSP) packaging markets are in creasing in the world, In general, transfer molding systems are using for t hese packaging process, But, transfer molding systems is difficult to chang e the model for high expensive metal die. Good advantage of this systems ca n get accuracy dimension of packaging. This paper describes a unique vacuum printing encapsulation systems (VPES) we developed to solve such problems with lower cost than transfer molding. We used matrix type EGA and CSP for this test. Matrix type EGA and CSP make easy to use printing technology at die-bonding, packaging, marking, and fl ax coating process. Total cost of these packaging are cheaper than transfer molding process. We developed very low warpage and high reliability epoxy resin for matrix E GA and CSP need much weight of epoxy resin than individual EGA and CSP, And it occurs very large warpage after curing. We succeed high reliability and low cost packaging systems with these technology.