Molecular dynamics study of thermally induced shear strain in nanoscale copper

Thermally induced strain and stress were calculated in a nanoscale copper s ystem using the molecular dynamics method. The shear strain in the system w as generated by a mismatch in the coefficients of thermal expansion between the materials surrounding it. Plastic deformation mechanisms, stress conce ntration and stress relaxation were studied. The results show that initiall y the stress is concentrated in the corners of the system, as suggested hy other studies. However, later when the structure has been plastically defor med, high stress regions are found in the center of the system.