Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process

Selective area sealing of hybrid microcircuits using isothermal solidificat ion requires a two-layer thick-firm process in which the surface of the 2nd conductor layer plays a significant role. Thick-film samples on ceramic su bstrate were fabricated and measurements of 1st conductor, dielectric and 2 nd conductor layer were taken using Taly surf. The surface roughness and th e effect of step of 1st conductor were measured in each case. It was found that the dielectric layer printing reduces the effect of step of 1st conduc tor layer and the same is considerably reduced after subsequent printing of the 2nd conductor layer on dielectric. Suggestions for further reduction i n the step are proposed. (C) 1999 Elsevier Science B.V. All rights reserved .