Several fundamental aspects of defect cluster accumulation in irradiated ce
ramics and face centered cubic metals are reviewed, with particular emphasi
s on radiation hardening and the microstructural evolution in Cu observed b
y transmission electron microscopy (TEM). At temperatures where interstitia
ls are mobile (> 50 K in Cu), the defect cluster density in pure Cu is init
ially proportional to the dose and exhibits a square root dose dependence a
bove similar to 10(-4) displacements per atom. This fluence dependence (det
ermined from electrical resistivity and TEM studies) helps to resolve a lon
g-standing controversy on the fluence dependence of radiation hardening. Th
e fraction of freely migrating interstitials in copper irradiated with 14 M
eV neutrons at room temperature is similar to 11%. The activation energy fo
r annealing stage V (stacking fault tetrahedra evaporation) in neutron-irra
diated copper has been measured to be 0.84 eV. Some features of the point d
efect accumulation behavior in ceramics are found to be very similar to the
trends observed in pure Cu, despite the obvious differences in the physica
l properties of these two types of materials. Finally, microstructural evid
ence for some processes unique to nonmetals are summarized, particularly io
nization induced diffusion.