ELECTROSTATIC ALUMINUM MICROMIRRORS USING DOUBLE-PASS METALLIZATION

Citation
J. Buhler et al., ELECTROSTATIC ALUMINUM MICROMIRRORS USING DOUBLE-PASS METALLIZATION, Journal of microelectromechanical systems, 6(2), 1997, pp. 126-135
Citations number
13
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
10577157
Volume
6
Issue
2
Year of publication
1997
Pages
126 - 135
Database
ISI
SICI code
1057-7157(1997)6:2<126:EAMUDM>2.0.ZU;2-0
Abstract
The fabrication of aluminum spatial light modulators has so far requir ed costly process engineering efforts. In this paper, a low-cost proce ss approach is presented, suitable for the manufacture of electrostati c micromirror arrays. The mirrors are made from the second metallizati on of complementary metal oxide semiconductor (CMOS) or bipolar proces ses deposited in two passes. This metal2 is protected by a photoresist layer that can be patterned using the top passivation mask of the pro cess. No additional layer deposition and layer structuring is necessar y during postprocessing. The actuators are released in a simple surfac e micromachining postprocessing sequence based on a sacrificial alumin um and silicon dioxide etch. Our approach allows one metallization to be used for both the circuitry and the electrooptomechanical devices. Deformable mirror arrays of up to 16 x 16 pixels were fabricated. Stat ic self-consistent electromechanical simulations using the finite-elem ent method (FEM) toolbox SOLIDIS were performed for a theoretical anal ysis and optimization of the actuator devices. [217]