The first valveless diffuser pump fabricated using the latest technolo
gy in deep reactive ion etching (DRIE) is presented. The pump was fabr
icated in a two-mask micromachining process in a silicon wafer polishe
d on both sides, anodically bonded to a glass wafer. Pump chambers and
diffuser elements were etched in the silicon wafer using DRIE, while
inlet and outlet holes are etched using an anisotropic etch. The DRIE
etch resulted in rectangular diffuser cross sections. Results are pres
ented on pumps with different diffuser dimensions in terms of diffuser
neck width, length, and angle. The maximum pump pressure is 7.6 m H2O
(74 kPa), and the maximum pump flow is 2.3 ml/min for water. [219]