Plasma-polymerized DCMPS as adhesive film characterization and properties

Plasma polymer layers of the thickness ranging from 10(-2) to 10(0) mu m in tended to engineer interphases in glass-fibre reinforced polymer composites and single-layer light-emitting diodes were prepared by r.f. glow discharg e technique. The films synthesized from a mixture of dichloro(methyl)phenyl silane vapour and gaseous hydrogen were deposited on flat glass and silicon substrates and glass fibres as well. Deposition conditions were optimized to obtain required thickness, mechanical and electrical properties of inter phases. Prepared layers were amorphous, relatively rigid and transparent at room temperature with excellent adhesion to substrates. The surface of pla sma polymer is rough with isolated (silicon substrate) and conglomerate (gl ass substrate) grains. FTIR and XPS spectra revealed a great amount of atom ic oxygen bound to silicon atoms and enabled to determine the atomic concen trations. The structure model is proposed assuming a random carbosiloxane n etwork with not-crosslinked methyl and phenyl groups.