Plastic module of laser diode and photodiode mounted on planar lightwave circuit for access network

Low-cost plastic packaging of laser diodes and photodiodes mounted on plana r lightwave circuit (PLC) platform are developed and its reliability is con firmed under various environmental and endurance tests. The high performanc e of the module is maintained under reliability tests, such as high-humidit y high-temperature tests (85 degrees C, 85 % RH) and temperature cycling te sts (-40 degrees C/85 degrees C). No laser diodes show any device character istics change during environmental tests and their stability has very littl e dependence on current bias. Although the photodiodes show an increase in leakage current under high-temperature high-humidity tests and the rate of leakage current increase is proportional to the square root of bias voltage , the increase is negligible for system use. These plastic modules can be a pplied to actual access networks and other fiber-optic networks.