Thermal stresses for bonded dissimilar materials with a circular-arc anticrack

The explicit full-domain solutions for the thermoelastic problem of bonded dissimilar materials with a circular-are anticrack have been obtained by ap plying the Hilbert problem formulation and a special technique of analytica l continuation. It is noted that the singularities of the stress field near the are anticrack tip are similar to those for the corresponding crack pro blem that would not be affected by the discontinuous jumps of the thermal p roperties across the interface. Both the rotation angle of an are anticrack and stress intensity factors due to the application of remote heat flux ar e obtained in an explicit form. For the purpose of illustration two typical examples for commonly used fiber-reinforced composites such as boron/epoxy and glass/epoxy system associated with an interface circular-are anticrack are examined and detailed results are provided in graphical form. The situ ations under which kinked cracks will initiate from an are anticrack tip ar e also discussed.