We investigated the structural characteristics of polycrystalline sili
con films formed by: (a) single-step laser annealing and (b) two-step
furnace at 600 degrees C and laser annealing of amorphous silicon laye
rs. The structure of poly-Si films of these two groups was studied by
cross-section and plane-view transmission electron microscopy observat
ions. In the first group and for constant substrate temperature, cryst
allite size was found to increase with increasing laser beam energy. H
owever, in this case the grain size never exceeded 300 nm. In the seco
nd group large crystallites are formed during the furnace annealing ha
ving a high density of in-grain defects. As laser energy increases the
in-grain defect density decreases, but the grain size remains constan
t. Above a certain critical energy however, grain size is drastically
reduced whereas the defect density within the grains remains low. (C)
1997 Elsevier Science S.A.