This paper describes the electrothermal IGBT short-circuit behavior. The mo
delling of the device has been realized using a physical approach based upo
n mobility models and general semiconductor equations. Electrothermal simul
ations of the device during the short-circuit phase brought to the fore sev
eral types of possible behavior: come back to equilibrium or breakdown (imm
ediate or delayed) according to the short-circuit duration. This study show
s moreover the influence of the different physical parameters (temperature,
mobilities, carrier concentrations, lifetimes) on the device behavior duri
ng this phase. Short-circuit experimental study has been made with conditio
ns as close as possible to simulation conditions, and eventually until comp
onent breakdown. This study allows to determine extreme operating condition
s (current, voltage, short-circuit time) and well confirms the simulation r
esults.