Characterization of a low-k organic spin-on-glass as an intermetal dielectric

In this paper, we used Fourier transform infrared spectroscopy (FTIR) to st udy the curing process and thermal stability of a low-k organic SOG (spin-o n glass), methyl silsesquioxane (MSQ). The solvent was completely driven ou t and the MSQ had a high degree of cross-linking after baking. Curing at a higher temperature causes further cross-linking. We also studied the effect of additional treatment processes, such as elect ron beam and ion implantation, in order to increase the resistance of the M SQ to oxygen plasma ashing. The FTIR spectra and SIMS data of these treated samples before and after oxygen plasma ashing are presented. We also measu red the refractive indices and the thicknesses of the samples before and af ter the electron beam/ion treatment to study the properties of the films. C opyright (C) 1999 John Whey & Sons, Ltd.