Thermoelectric measurements for bondability analysis of bond pads: a new concept for a bondability analyser

We present a new apparatus to determine the ultrasonic wire bonding behavio ur of different contact materials. The basic principle of the developed bon dability analyser is measurement of the temperature at the bond ball during the ultrasonic friction process by using a thermocouple instead of a bond wire. We tested the bondability analyser by analysing different bond pads w ith high and low bond contact quality and comparing the results with pull f orce measurements of the wire bond, The results show that the bondability a nalyser characterizes the ultrasonic wire bonding behaviour of bond pads pe rfectly, In addition, the apparatus allows the wire bonding process to be s tudied in detail and in real time. Copyright (C) 1999 John Wiley & Sons, Lt d.