Thin is in: Wafer-thinning method delivers ultra-slim chips with a clean process

Authors
Bursky, D
Citation
D. Bursky, Thin is in: Wafer-thinning method delivers ultra-slim chips with a clean process, ELECTR DES, 47(18), 1999, pp. 27-27
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONIC DESIGN
ISSN journal
00134872 → ACNP
Volume
47
Issue
18
Year of publication
1999
Pages
27 - 27
Database
ISI
SICI code
0013-4872(19990907)47:18<27:TIIWMD>2.0.ZU;2-R