Low dielectric constant materials for advanced interconnects

Citation
M. Morgen et al., Low dielectric constant materials for advanced interconnects, JOM-J MIN, 51(9), 1999, pp. 37-40
Citations number
52
Categorie Soggetti
Metallurgy
Journal title
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
ISSN journal
10474838 → ACNP
Volume
51
Issue
9
Year of publication
1999
Pages
37 - 40
Database
ISI
SICI code
1047-4838(199909)51:9<37:LDCMFA>2.0.ZU;2-S
Abstract
Materials with low dielectric constants are being developed to replace sili con dioxide as interlevel dielectrics. This paper discusses material issues and the characterization of low-k materials for integration into advanced interconnects. Measurement techniques for the characterization of low-k fil ms are discussed, and the results for several classes of low-k materials ar e presented. The properties of these materials are discussed in relation to structure-property relationships.