The initial stages of growth of polycrystalline silicon films by silane dec
omposition, at a pressure of 230 mTorr and a temperature of 610 degrees C i
n a conventional low pressure chemical vapor deposition reactor, have been
studied. Depositions at times varying between 1 and 5 min have been made on
two kinds of SiO2 covered, (100) Si substrates: i) immediately after withd
rawal from the oxidation furnace ("fresh") and ii) left in the clean room f
or 24 hours after oxidation ("aged" oxides). The microstructural characteri
stics of these deposits (grain size and roughness) were studied with atomic
force microscopy. It was found that grain size and surface roughness were
decreasing with deposition time, and that films grown on "fresh" oxides exh
ibited smaller grain size and lower roughness, than films grown on "aged" o
xides. After the first 5 min of deposition, the state of the substrate surf
ace ceased to influence the grain size which became identical for films gro
wn on both kind of surfaces, while it continued to influence the roughness
of the samples. Such behaviour has not been observed in thicker films grown
on "fresh" and "aged" oxides that have been studied with transmission elec
tronic microscopy. The above observations were attributed to the increase o
f "activated" sites coverage with deposition time, which in turn has caused
an increase of the activation energy for the surface diffusion of adsorbed
silicon atoms. Surface "ageing" causes a decrease of sites available to fo
rm bonds, due to the absorption of impurities from the clean room ambient.