A new process for CVD of zirconium oxide is presented. With zirconium tetra
iodide, ZrI4, and oxygen as starting materials, crystalline ZrO2 is deposit
ed on Si(100) at lower temperatures than with the conventional halide proce
sses. The films are smooth and well-adherent and show no trace of iodine. T
his work describes the basic features of the new process as well as the mic
rostructural and electrical characteristics of the ZrO2 films.