Jh. Kim et al., Application of the three omega thermal conductivity measurement method to a film on a substrate of finite thickness, J APPL PHYS, 86(7), 1999, pp. 3959-3963
The three omega thermal conductivity measurement method is analyzed for the
case of one or more thin films on a substrate of finite thickness. The ana
lysis is used to obtain the thermal conductivities of SiO2 films on Si subs
trates and of a chemical vapor deposition (CVD) diamond plate. For the case
of the SiO2 films on a Si, we find an apparent thickness dependence of the
thermal conductivity of the SiO2 films. However, the data can also be expl
ained by a thickness-independent thermal conductivity and an interfacial th
ermal resistance. For the case of the CVD diamond plate, the fit of the the
ory to the experimental data is significantly improved if we assume that an
interface layer separates the heater from the diamond plate. (C) 1999 Amer
ican Institute of Physics. [S0021-8979(99)01319-5].