Application of the three omega thermal conductivity measurement method to a film on a substrate of finite thickness

Citation
Jh. Kim et al., Application of the three omega thermal conductivity measurement method to a film on a substrate of finite thickness, J APPL PHYS, 86(7), 1999, pp. 3959-3963
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
86
Issue
7
Year of publication
1999
Pages
3959 - 3963
Database
ISI
SICI code
0021-8979(19991001)86:7<3959:AOTTOT>2.0.ZU;2-I
Abstract
The three omega thermal conductivity measurement method is analyzed for the case of one or more thin films on a substrate of finite thickness. The ana lysis is used to obtain the thermal conductivities of SiO2 films on Si subs trates and of a chemical vapor deposition (CVD) diamond plate. For the case of the SiO2 films on a Si, we find an apparent thickness dependence of the thermal conductivity of the SiO2 films. However, the data can also be expl ained by a thickness-independent thermal conductivity and an interfacial th ermal resistance. For the case of the CVD diamond plate, the fit of the the ory to the experimental data is significantly improved if we assume that an interface layer separates the heater from the diamond plate. (C) 1999 Amer ican Institute of Physics. [S0021-8979(99)01319-5].