A new surface-alloying technique for pure copper

A totally new technique of surface modification-thermal surface-alloying tr eatment for pure copper-was developed. A 0.2-1.8 mm copper alloy layer, whi ch has a hardness 4 to 5 times higher than the pure copper substrate, was f ormed after the treatment. The significance of this technique is that the s urface of pure copper can be efficiently hardened without significant reduc tion of the overall thermal and electrical conductivity. Variations of comp osition and microstructure in the alloy layer were studied after pure coppe r was surface ahoy treated with aluminum.