A new method to study cyclic deformation of thin films in tension and compression

In this paper, a new method to study cyclic plastic deformation in thin met al films is presented. Cu films were deposited onto compliant substrates al lowing the film to be subjected to tensile and compressive stresses on load ing and unloading of the film/substrate composite. The film stress was meas ured in situ by x-ray diffraction. First results lend to characteristic str ess-strain hysteresis curves, indicative of fatigue processes in small dime nsions.