Growth of carbon nitride thin films by radio-frequency-plasma-enhanced chemical vapor deposition at low temperatures

Citation
Sf. Lim et al., Growth of carbon nitride thin films by radio-frequency-plasma-enhanced chemical vapor deposition at low temperatures, J MATER RES, 14(3), 1999, pp. 1153-1159
Citations number
46
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS RESEARCH
ISSN journal
08842914 → ACNP
Volume
14
Issue
3
Year of publication
1999
Pages
1153 - 1159
Database
ISI
SICI code
0884-2914(199903)14:3<1153:GOCNTF>2.0.ZU;2-H
Abstract
In this paper, we report our findings in the deposition of carbon nitride b y radio-frequency-plasma-enhanced chemical vapor deposition (RF-PECVD) at t emperatures slightly above room temperature (RT) and pressures of 800 mTorr using NH3 and C2H4 as source gases. The variation of the NH3/C2H4 source g as ratio and rf power is shown to affect the N/C ratio and sp(3)/sp(2) rati o in a reproducible manner. An N/C ratio as high as 1.17 has been obtained under optimized growth conditions of NH3/C2H4 ratio of 7.3 and rf power of 90 W. X-ray diffraction (XRD) indicates the presence of microcrystalline ca rbon nitride in an amorphous CNx matrix with preferred orientation along th e (100) direction. X-ray photoelectron microscopy (XPS) and Fourier transfo rm infrared spectroscopy (FTIR) studies show that our assignment of the XPS peaks and FTIR absorption bands are mutually consistent and in good agreem ent with published data. Both methods of analysis show the increase in the sp(3) component with increase in N incorporation in the film.