Formation of PdS compounds in direct metallization via Pd/Sn catalyst activation

Citation
Yy. Chiang et al., Formation of PdS compounds in direct metallization via Pd/Sn catalyst activation, J ELCHEM SO, 146(9), 1999, pp. 3255-3258
Citations number
11
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
146
Issue
9
Year of publication
1999
Pages
3255 - 3258
Database
ISI
SICI code
0013-4651(199909)146:9<3255:FOPCID>2.0.ZU;2-8
Abstract
The reaction mechanism between a Pd/Sn catalyst and sulfide ions which were used to promote direct copper plating was studied. The identity of reactio n products after activation, acceleration, sulfide promotion, and plating b ath dipping were analyzed by infrared absorption spectroscopy and X-ray dif fraction. It wa found that the chemically adsorbed sulfides ions do not rea dily form PdS. The stable PdS appears only after it is dipped in the platin g bath. The major agent responsible for this transformation was found to be the sulfate ions. (C) 1999 The Electrochemical Society. S0013-4651(98)09-0 73-X. All rights reserved.