Low-temperature large-grain poly-Si direct deposition by microwave plasma enhanced chemical vapor deposition using SiH4/Xe

Citation
W. Shindo et al., Low-temperature large-grain poly-Si direct deposition by microwave plasma enhanced chemical vapor deposition using SiH4/Xe, J VAC SCI A, 17(5), 1999, pp. 3134-3138
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
ISSN journal
07342101 → ACNP
Volume
17
Issue
5
Year of publication
1999
Pages
3134 - 3138
Database
ISI
SICI code
0734-2101(199909/10)17:5<3134:LLPDDB>2.0.ZU;2-5
Abstract
Polycrystalline silicon is grown at a temperature of 300 degrees C by micro wave-excited plasma enhanced chemical vapor deposition using SiH4/Xe. The g rain size measured by x-ray diffraction is about 25 nm. High-density (> 10( 12) cm(-3)) plasma having very low electron temperature (<1 eV) is excited by microwave irradiation using radial line slot antenna. We present the imp lementation of this system for the growth of poly-Si. Low-energy (3 eV), hi gh-flux ion bombardment utilizing xenon ion on a growing film surface activ ates the film surface and successfully enhances surface reaction/migration of silicon, resulting in high quality film formation at low temperatures. ( C) 1999 American Vacuum Society. [S0734-2101(99)21704-6].